Background

Join a new multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry.

In a transaction valued at $9B, Intel Corporation is spinning-off its NAND Memory Business—a global leader in the design and manufacture of integrated circuits and solid-state drives (SSDs) for use in data centers, personal computers, and other devices—to form an independent company that will be a subsidiary of parent company SK hynix.

The new company will be headquartered in San Jose, California, with aspirations to conduct an IPO and become a publicly traded U.S. company. As the current head of Intel’s Memory Business, Rob Crooke will lead the new company as CEO, with a number of Intel executives and senior leaders joining him to stand-up and grow the new company. The new venture combines elements of an established, successful Silicon Valley technology company with the spirit, agility, and entrepreneurial mindset of a start-up.

In addition to the U.S. headquarters and other facilities in the U.S., the company has a significant international presence in Asia, Europe, and the Americas. The newly formed company will continue to lead the world in innovating new Memory technologies and will soon be the second largest NAND memory company in the world by revenue.  

You can be part of the takeoff at the start of a fast-growing business that develops products and solutions that deliver strong business value for customers, an engaging workplace for employees, and a greater impact on the world. Our goal is simple: Grow at an unprecedented rate and become the best memory solutions company in the world.

This is an opportunity for the right applicant to join us and help design, build, and lead the new company’s Engineering team. We want a team of Engineering professionals who will be strategic partners with the business.  We are seeking applicants who will grow and thrive in our culture: team-oriented, diverse, innovative, customer inspired, results driven, disciplined, passionate, and adaptable.

This position is associated with the sale of Intel's NAND memory and storage business to SK hynix. You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf. The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.

This is an exciting time to be at Intel - come join our Data Center NAND Division as a Product software Engineer and work on one of the most advanced 3DNAND and SSD technology portfolios in the world. As the global leader in the semiconductor industry, Intel possesses many industry-leading SSD technologies including the most capable Quadruple Level Cell NAND Flash products. As a Product software Engineer, you will be part of a world-class team that will transition to lead the SSD business at SK hynix.

This position aligns to Phase 1 of the transaction, which includes the 3DNAND enterprise and client SSD business. Phase 1 is expected to close in late 2021, subject to regulatory approvals and other customary conditions. At deal close, all employees aligned to this phase of the transaction will transition to SK hynix.

You will be part of the NSG SSD Engineering team responsible for Product Development Engineering and ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp for NSG's high performance, revolutionary NAND Solid State Disk Drives in our ODM, also own test software and Firmware developments independently for new and derivative Media/SSD products. You will work with Design Engineering, Systems Engineering, Firmware, Hardware, Material and NSG's SSD ODM to help develop and verify proper software capability/improvements, to ensure adequate quality of Intel-branded Media systems and SSD modules.

Your responsibilities will include but not be limited to:
1. Making significant contributions to design, development and validation of testability circuits. Evaluation, development and debug of complex test methods. Developing and debugging complex software programs to convert design validation vectors and drive complex test equipment.
2. Designing and carrying out experiments to identify failure root cause and fix validation.
3. Performing electrical failure analysis using available tools.
Support SSD qualification, SSD test flow/method development, yield improvement in ODM.

- Bachelor or Master's degree in Electrical Engineering or Computer Science, etc.
- C/C++/python experience. Familiar with Linux OS and drivers.
- Experience in Storage/memory or SATA/SAS/PCIe would be a plus.
- Excellent teamwork and leadership skills and the ability to work well with teams outside of Intel, both in the US and Asia.

All your information will be kept confidential according to EEO guidelines.