Req. ID: 138504
- Diploma in Engineering (or Related field of study) or equivalent experience the following field: Materials Engineering, Materials Science, Mechanical Engineering is preferred.
- 1 year experience in any of the following: Electronic Packaging, Lab Tech, Semiconductor Packaging
- Proficient in Microsoft Office Suite
- An understanding of semi-conductor manufacturing or micro-electronics assembly
- An understanding of Micron manufacturing (preferred)
- Experience with Micron MAM tracking (preferred)
- Demonstrate multi-tasking and problem solving experience
- The ability to collaborate well with team members
-
Strong verbal and written communication skills以下工作待遇包含本薪、伙食津貼、輪班津貼,實際薪資會依照出勤班別計算。
激勵獎金(IPP)或其他福利另計。
工作待遇:月薪3萬9仟元 至 4萬6仟元
According to the "Employment Service Act", any position with salary lower than NTD$40,000, please refer to the salary information in the job description. Positions with a salary over NTD$40,000 may not be mentioned in the job description and will be discussed in interview.
We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form
Keywords: Taichung || Taichung City (TW-TXG) || Taiwan (TW) || Quality || Experienced || Regular || Engineering || Not Applicable || Tier 3 ||
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