Directly manages both programs and projects that are directly tied to the development, implementation or upgrade of technology or products for external customers. Handles projects of moderate scope and high complexity or of broad scope and moderate complexity. Plans/manages projects directly related to policies or general business operations to meet specific objectives or general goals. Has decision making authority at the project level. Leads the project team and is key interface to the project or contributors. Identifies and refines project objectives. Works on or delegates, as appropriate, problems/tasks in delivery of specific objectives or general goals. Develops solutions to problems by exercising judgment and discretion. Interprets and applies controlling business strategies or corporate policies and deviates as judged appropriate. Identifies tasks and research, determines dependencies, assesses costs, and identifies and assigns specific resources, and communicates expectations to team members. Creates/tracks/adjusts the project or program schedule. Assesses risks and identifies issues and solutions to timely and efficiently achieve program goals or project objectives while maintaining quality standards. Monitors progress against schedule and determines and takes remedial action as appropriate. Coordinates and prioritizes utilization of resources with other functions. Plans and schedules work ensure the completion of intermediate milestones and overall project or program in timely manner. Influences or sets business unit or crossorganizational strategy. Understands the technical concepts, architecture, systems, development methods, and disciplines associated with the defined projects, applies the knowledge to deliverables, and leverages it to accelerate project completion.

This position is associated with the sale of Intel’s NAND memory and storage business to SK Hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business’ storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.  

This is an exciting time to be at Intel – come join our NAND-DTM and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Quadruple Level Cell (QLC) NAND Flash products, and you will be part of a world-class team that will transition to lead the SSD business at SK Hynix.

This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK Hynix. 

Qualifications

In this position, the candidate will work closely with tool installation design, construction, tool owners, supply chain and finance team , to estimate and validate Contractor proposals for projects of Tool installation, SPGC(Small Project General Contract), etc. This includes (but not limited to) design, actual construction work, reference tool package, and etc. to ensure the finished work aligns to the quotation outlined scope. . The candidate is also expected to understand the SOW best practice of the tool IQ execution and be able to identify the cost saving opportunities, understand the market price and trend, and alternative materials that can drive the IQ cost down without impact the IQ safety, velocity and quality.

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.