Job description

• Design of circuits for Monolithic Integrated Lidar modules, Laser sensors, Lasers, etc.
• Development of PCB layout, SMT, testing of circuits from lab tests to industry requirements, make critical analysis for process yield, and conduct Design of Experiment (DoE) for process improvement for mass production
• Utilizing of equipment such as oscilloscope, multi-meters, signal generator, soldering etc.
• Utilizing of electronic / electrical power device package on board, die-bond, wire-bond, flip-chip etc.
• Chip level testing (gain, voltage, current, power device drive scheme, bandwidth analysis, efficiency, laser and Lidar parameter testing, and reliability)
• Occasional travel to Mainland China when required

Requirements:

• BSc/BEng/MPhil/PhD degree in Electronic Engineering or other related disciplines have experiences in any one of the following areas: circuit or IC design and process, power devices packaging process. Applicants with less related experiences would be considered for junior position.
• Knowledge on circuit design and layout and hand-on experiences in circuit testing
• Hand-on experiences in any kind of the following skills: die bonding, wire bonding, flip-chip bonding, etc.
• Six-sigma knowledge and certification are preferred
• Ability to work independently and strong problem-solving skills
• Good command of both spoken and written English and Chinese