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You will work as assembly process integration engineering inside packaging engineering group. Leads new product development from concept design to qualification and eventually transfer to mass production. Create new product ideas and Make ideas into real products.

• Leads new product development from concept design to qualification and eventually transfer to mass production.
• Work closely with global functional teams in US, Indian, and Israel, review feasibility design drawings, propose structure design options and launch mechanical sample builds.
• Work closely with both internal teams, validate design options through characterization builds, perform cost analysis, request mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing, yield and quality.
• Execute package qualification plan, follow up package reliability status, investigate and close failures on time. Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement, and manage excursions.
• Lead new product low volume to high volume production transition; make sure yield and quality meet goal. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
• Lead new packaging technology transition (new wafer tech/process/material) from engineering stage up to volume production.

• Master or PhD Degree major in Material Science, Polymer Science, Mechanical Engineering, or other engineering subjects
• Self-motivated and self-directed
• Hard working, and be able to work under high pressure
• Ability to troubleshoot and analyze complex problems

PREFERRED:

• Have strong interest in semiconductor industry
• Interest in consumer electronics

SKILLS

• Excellent English communication (written and verbal) skills
• Good Interpersonal skills