Senior Engineer, Packaging Engineering
Western DigitalShanghaiUpdate time: October 22,2021
Job Description
职位描述
- Maintain WDC's substrate design roadmap and substrate fabrication rules.
- Work closely with substrate suppliers to develop new substrate technologies or advanced design rules to meet product roadmap requirements.
- Handle and integrate all development activities related to substrates in the packaging process.
- Assist a DFM(design for manufacturability) process closely with Substrate layout designers to reduce the substrate design risk.
- Analyze the technical gap between the substrate suppliers and WDC substrate designs, drive and follow up with the substrate suppliers for improvement.
- Perform cost/performance trade-off analysis on various substrate design rules to realize the principle of low-cost design.
- Integrate substrate suppliers and packaging teams to solve substrate-related issues in the product development stage.
职位要求
- Master degree or above in Material, Chemistry or engineering related.
- More than 3 years of packaging process experience or substrate manufacturing experience.
- Skills in SEM, FIB, TMA, DMA are preferred.
- Skills in DOE design, statistical analysis tools, AutoCAD are preferred.
- Good communication skill and office software skills.
- Good teamwork and quick learning.
额外信息
All your information will be kept confidential according to EEO guidelines.
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