Taking responsibility of the management of unit test and assembly BOP, ensure production line smooth run and fulfill shipment requirement

负责测试和后段封装部门的生产管理，保证产线正常运行,保障出货要求

Refer to MFG KIP and KPI setting department KIP and KPI goal, meanwhile fulfill your goal setting

按照MFG KIP和KPI指定本部门的目标，并完成

Familiar with semiconductor test and assembly process flow

熟悉半导体封装及测试的制造流程

Be able to ensure that deliver products meet all company quality, cost, quantity and delivery requirements.

能够确保交付的产品符合公司的质量、成本、数量和交付要求

Implementing cost reductions; initiating and developing a spirit of cooperation between and within departments

实施成本控制;倡导和发展部门之间和内部的合作精神

Resolves problems by analyzing data, investigating issues and identifying solutions.

通过分析数据、调查问题、确定解决方案来解决问题。

Maintains safe and clean work environment by educating and directing personnel on compliance with work instruction, procedure and company policy.

通过教育和指导员工服从工作指导，流程和政策来维护安全、清洁的工作环境。

Contributes to team effort by accomplishing related results as needed.

根据需要完成相关工作，为团队做出贡献。

·       Bachelor degree and over will be plus+

·       本科学历及以上

·       Minimum 5 years working experience as supervisor in Semiconductor or similar background and peer position experience

·         5年以上半导体 或类似的主管。

·       English/Mandarin Communications Skills

·       良好的中英文沟通能力

·       Prefer Sigma Yellow/Green Belt

·       Sigma 黄带/绿带 优先

·       Lean knowledge

·       具备精益生产知识

·       Well teamwork spirit and optimistic character

·       团队合作精神和乐观向上的性格

All your information will be kept confidential according to EEO guidelines.