This is a senior technical leadership role that will use your experience to close technical, architectural, and specifications within Intel® and its contractors.

You will be an essential part of an applied research and pathfinding team who are inventing and proving out technology to grow Intel's competitive advantages.

Evaluate bleeding-edge technologies and bring them to Intel's current and future FPGA products.

You will work with various teams on IP and system level design/development and ensure execution is on the right track.

You will be working with the Platform team on silicon/board bring-up, characterization and demonstration of Proof-of-Concept (POC) devices.

Interact with customers and close their technical requirements from POC to products.

This position is not eligible for Intel immigration sponsorship.

Qualifications

Minimum Education Requirements:  

• Master of Science in Electrical Engineering, or Computer Engineering or related field, or equivalent with minimum of 12 years of industry experience:

Minimum Required Qualifications:

• 8+ years of proven track record in technical leadership and project management, including contractors, partners, and suppliers.
• 8+ years of experience in concept capture, architecture definition, and system level integration.
• 10+ years of experience in silicon design/tools (RTL/Schematic design, DFT, Design Verification, Custom layout, PNR, Static timing analysis).
• 10+ years of experience in silicon bring-up, debug, testing and characterization
• 5+ years of experience in high-speed transceiver design and protocols (PCIe, Ethernet, JESD204, etc.)
• Comfortable operating in ambiguous, fast-paced environments where technology change and innovation are constant.
• Analytical experience and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions.

Additional Preferred Qualifications:

• Experience with silicon process technology (advanced nodes preferred), multi-chip integration, co-packaging, assembly, testing and manufacturability.
• Experience with interfaces such as AIB (Advanced Interface Bus), CXL (Compute Express Link), or MDIO (Multi-Die I/O).
• Experience in silicon photonic (SiPh) design, packaging, assembly, and manufacturing is a big plus.

The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.