Intel put the Silicon in Silicon Valley. No one else is this obsessed with engineering a brighter future. Every day, we create world changing technology that enriches the lives of every person on earth. So if you have a big idea, let’s do something wonderful together. Join us, because at Intel, we are building a better tomorrow. Intel’s mission is to shape the future of technology to help create a better future for the entire world. By pushing forward in fields like AI, analytics and cloud-to-edge technology, Intel’s work is at the heart of countless innovations.
You will be part of Intel Programmable Solutions Group (PSG) CTO Office that is at the forefront of advanced technology development. We are partnering with the Government, Defense Industrial Base (DIB), and Commercial customers to develop broad spectrum of technologies. We bring bleeding-edge technologies from concept to reality and enable technology transfer team to bring them to products.
Evaluate bleeding-edge technologies and bring them to Intel's current and future products.
Work with cross-functional teams on IP and system level design/development and ensure execution is on the right track.
Work with the Platform team on silicon/board bring-up, characterization and demonstration of Proof-of-Concept (POC) devices.
Interact with customers and close their technical requirements from POC to products.
This position is not eligible for Intel sponsorship.
Qualifications
Minimum Education Requirements:
Bachelor/Master of Science in Electrical Engineering, or Computer Engineering or related field, or equivalent.
Minimum Required Qualifications:
5+ years of experience in concept capture, architecture definition, and system level integration.
5+ years of technical and project management skill, including contractors, partners, and suppliers.
5+ years of experience in silicon designs/tools (Digital/Analog design, RTL design, Physical design).
5+ years of experience in silicon bring-up, debug, testing and characterization
Additional Preferred Qualifications:
Eight years of industry experience
Experience with silicon process technology (advanced nodes preferred), multi-chip integration, co-packaging, assembly, testing and manufacturability.
Experience with interfaces such as AIB (Advanced Interface Bus), CXL (Compute Express Link), or MDIO (Multi-Die I/O).
Familiar with Data Center or Cloud system IO and interconnect.
Experienced in silicon photonic (SiPh) design, packaging, assembly, and manufacturing is a big plus.
The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.
Other Locations
US, California, Folsom;US, California, Santa Clara
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
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