Job Purpose

1. Discrete Power Package Design (Lead Frame, Package Outline, Bond Diagram, Internal components)

2. Power Package design considering design rule and advanced design rule

3. Technical leading design related job locally and externally out of China

4. Designer who is expert level on 2D & 3D modeling, Knowledgeable on Geometric Dimensioning and Tolerancing, knowledge on Semiconductor Assembly Processes and Design Rules (Sawing, DA/SMT, Al/Au WB, Molding, Plating, TnF, FT, Packing), knowledge on Wafer Fab processing and understanding of Die mask & vertical structures of MOSFET/IGBT/DIODES/ IC's, Knowledge on Wire Bonding diagram generation., Perform Assembly Design Rule Check for all New Products Dev't., * Knowledgeable on Jedec & EIAJ Packaging Standard, Knowledge on Magazine, Plastic Tubes, and other Jig & Fixture

Duties and Responsibilities

1. Expert in designing Leadframes & Packages for semiconductor package by AutoCAD and Solidworks with communication with external or internal customers by English skills (preferred if High Voltage Discrete Semiconductors and IGBT High Power Modules experienced). Lead the design team in achieving management goals from prototyping to manufacturing release with more emphasis on automotive products which makes Fairchild a market leader and model in Semiconductor industry.

2. Expert in tooling design used in a Semiconductor Process. Expertise includes in designing complex Assembly Jigs & Fixtures, Diebonder conversion kits, Wirebonder Clamps & Anvils, Mold and Trim Tool & Die, and other critical tooling used in Test Handlers.

3. Lead the design review meeting and conferences especially for New Automotive product “High Voltage Discrete Semiconductor packages”. Also lead and guide cross functional team members in providing justifications of designed Leadframes & Packages both in development stage and mass production released.

4. Responsible in generating and maintaining design documentation like Design Review Material, DFMEA and all manufacturing drawing like Leadframe, Substrate, Tooling, Marketing Outline, Package Outline, Molded Outline, and Wire Bonding Diagram.

5. Responsible in analyzing stress on Semiconductor Package and IGBT Power Modules like Mechanical, Electrical & Thermal stress and able to mitigate during design phase thru the use of Finite Element Analysis results.

6. Responsible in analyzing assembly critical package design rule thru the use of (EPD) Electronic Package Design Rule check software and able to address before final design release and approve by manufacturing.

7. Responsible in defining appropriate (BOM) bill of materials and processes to achieve secured manufacturability, quality, cost and robust package reliability performance.

8. Responsible in coordinating direct materials and tooling deliveries to meet development schedules by collaboration of all involve departments and early closure of Technical Design Review with suppliers.

9. Originate and responsible in maintaining Assembly Package Design Rule specs and updating by lesson learned from previous quality incidents to prevent reoccurring.

10. Lead design and mentor to Junior Engineers and conduct training to colleagues to improve overall Engineering Technical capability and work ethics.

Qualifications

• Education: Minimum 4yrs college or university graduated.
• Specialized knowledge: Semiconductor Device & Process and Assembly Process and Material
• Skills: AutiCAD, Solidworks, Communication skills, Fluent with written English and speaking. Min level 4 and recommended 6.
• Other characteristics such as personal characteristics : Self motivated, independent, open mind to communicate, be willing to take risk
• Experience : Package Design for Power discrete (TO220, TO247, D2PAK etc)

上班地址：苏州工业园区苏桐路1号

安森美半导体苏州是全球首屈一指，针对多元终端市场提供高性能功率产品的全球第二大供应商。1999 年，安森美半导体从摩托罗拉分离出来，于 2000 年成为一家上市公司。
苏州工厂是原Fairchild（快捷半导体）集团公司于2002年2月在中国设立的一家工厂。在2016年与安森美正式合并，公司坐落于苏州工业园区美丽的金鸡湖畔。2016年以来生产订单一直处于增长中，并不断扩产。公司现有员工1900多人，主要从事封测、产品开发和封装研发的业务。产品包含功率器件、模拟器件和功率模块，广泛运用于汽车、家电、消费电子等领域。

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乘车路线：100，28，142，207路到加城大厦站下车，往南走200米。
26，27，307，518，818路到苏桐路站下车，往南走50米。