Analog Devices (NASDAQ: ADI) designs and manufactures semiconductor products and solutions. We enable our customers to interpret the world around us by intelligently bridging the physical and digital worlds with unmatched technologies that sense, measure and connect.

 

The Packaging Engineer role is based in San Jose, CA.  As a member of the power package development group, responsible for the New Product Introduction (NPI), from design through qualification and release of the product to production and for the development of new module package technologies working closely with the product design engineers and the factories.

 

Responsibilities:

• Develop materials, assembly processes, process control plans with material suppliers, assembly vendors during NPI.
• Develop and implement package design rules and other specifications for module assembly process.
• Design and qualify new package solutions to meet and exceed the electrical, thermal and mechanical requirements of products.
• Generate build sheets, package outline drawings and other specifications required for release of product.
• Qualify the new products coordinating the required package level and board level reliability testing with the quality and reliability group and conduct any failure analysis as required.
• Achieve the target assembly yields for each product during the NPI phase to pass the final gate check to release to production.

 

Qualifications: 

Bacholer's (Master's Degree perfered) plus 5 years of experience in a package and assembly manufacturing position with previous expereince in:.

• SMT process development;
• Design and develop new laminate based System-in-Package with pacakged devices, passive components and interconnect technologies;
• Develop and implement laminate, flipchip bumping and assembly design rules; good materials background on solder materials, solder joint reliability, die attach, molding compounds;
• Lead new product introduction of packages in different assembly factories, validate the materials, process parameters using Design of Experiments (DOE) methodology, and establish necessary process controls and monitors prior to production release;
• Qualify the designed package, materials and processes through reliability stress testing; 
• Must be knowledgeable in JEDEC and IPC requirements for component and board level reliability qualification;
• Perform failure analysis of defects generated during assembly process development and or reliability testing using X-ray, Confocal Scanning Acoustic Microscopy (CSAM), cross-section techniques that include analyzing with scanning electron microscope (SEM), Energy Dispersive Analysis X-ray (EDAX);
• Project management involving cross functional teams involving internal groups (Design, Product Marketing, Quality and Reliability, Manufacturing), external groups (material and assembly turn-key suppliers) from the design stage of the product to the production ramp phase.
• Understanding of Chip-Package interactions, silicon technology design rules, and wafer level packaging is preferred.

 

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

 

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

 

EEO is the Law: Notice of Applicant Rights Under the Law

 

Education Level: Master's Degree 
Travel Required: Yes, 10% of the Time