The future. It’s on you. You & Western Digital.

We’ve been storing the world’s data for more than 50 years. Once, it was the most important thing we could do for data. Now we’re helping the world capture, preserve, access and transform data in a way only we can.

The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data.

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data. 
 
Western Digital® data-centric solutions are found under the G-Technology™, HGST, SanDisk®, Tegile™, Upthere™, and WD® brands.

• As a packaging engineer, you will work in the Packaging - MCOE and Cost Ops department on new project coordinating to success.
• In this position, you will be responsible for resources availability to support on new product evaluation, sample make, process characterization and PFA/EFA

• More than 5 years at semiconductor assembly process at equipment engineering or process engineering position.
• Familiar with SIP process flow and process characterization.
• Honest, hard work, and innovation mindset.
• Self work dependency capability.
• Strong engineering knowledge at PSM JMP, DOE and so on.

Because Western Digital thrives on the power of diversity and is committed to an inclusive environment where every individual can thrive through a sense of belonging, respect, and contribution, we are committed to giving every qualified applicant and employee an equal opportunity.  Western Digital does not discriminate against any applicant or employee based on their protected class status and complies with all federal and state laws against discrimination, harassment, and retaliation, as well as the laws and regulations set forth in the "Equal Employment Opportunity is the Law" poster.