Taiwan - Kaohsiung

- Drive suppliers to meet and exceed QCT bumping, WLP, FO/FX WLP quality requirements and ensure full compliance - Work with suppliers to closely monitor and improve bumping, WLP and FO/FX WLP quality metrics - Closely collaborate with AP Ops and US teams on WLP PRU and PCN soft-landing data review and drive for successful implementation - Conduct Bumping ,WLP and FO/FX WLP audits and participate in regular suppliers/US team conference calls. Position will require frequent travel domestically & oversees - Drive systematic improvements at suppliers through ongoing supplier visits and tracking implementation of key initiatives. - Follow up problem investigations and validate corrective/preventive actions to reduce excursions and RMA/NC incidents - Escalation of issues to AP Ops and US management and throughout cross functional teams as required.

Minimum of five years of semiconductor industry experience with a minimum of 2 years working directly with foundries and OSATs.

Thorough understanding of device physics, reliability concepts and wafer processing. Able to deal with complex issues related to bumping, WLP, FO/FX WLP in advanced technology

Hands-on experiences of Fab or OSATs inline and PCM process control. Bump and/or WLP, FO/FX WLP experience is a plus.

Good understandings of quality procedure such as management of process change, problem solving/8D report, FMEA and audit etc.

Excellent verbal, written and presentation skills (in both Mandarin and English). Ability to interact and gain cooperation of various cross functional team members.

- Required: Bachelor's, Electrical Engineering, Mechanical Engineering or equivalent experience - Preferred: Master's, Electrical Engineering, Mechanical Engineering or equivalent experience

Required: Bachelor's, Electrical Engineering, Mechanical Engineering or equivalent experience

Preferred: Master's, Electrical Engineering, Mechanical Engineering or equivalent experience