Taiwan RDSS- Product Development Engineer
Intel新竹市Update time: September 14,2019
Job Description
Job Description
  • Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
  • Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.
  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
  • Conducts tests and research on basic materials and properties.
  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.


Qualifications

Job Description
�Responsible for ensuring the testability and manufacturability of integrated circuits from the media/Nand component feasibility stage through production ramp.
�Make significant contributions to design, development and validation of testability circuits.
�Evaluation, development and debug of complex test methods. Develops and debugs complex device attribute to convert design validation vectors and drive complex test equipment.
�Supports and tests validation and production test hardware solutions.
�Tests, validates, modifies and redesigns circuits to guarantee component margin to specification.
�Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.
�Analyzes early customer returns with emphasis on driving test hole closure activities.
�Creates and applies concepts for optimizing component production relative to both quality and cost constraints.
�Autonomously plans and schedules own daily tasks, develops solutions to problems utilizing formal education and judgment.

Preferred
�Having Python and SQL skill to support data mining and test log analysis.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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