Position:

Technical Manager

Job Description:

1:solder capability, Can solder 0201 size capacity/inductance and QORVO PA by himself when support customer, This is the basic capability requirement.
2:Equipment use, Able to use MT8820/8960/CMW500/CMU200/VNA skilfully.
3:Familiar with 3GPP standard requirements
4:Have 2G/3G/4G mobile RF debug experience on Qualcomm/MTK platform

Location:

Shenzhen (ATM)

Time Type:

Full time

Job Category:

Sales