Intel is seeking a qualified candidate to join our DCAI (Data Center and Artificial Intelligence) group as a Thermal Engineer to design and analyze mechanical systems, equipment, and Silicon packaging. They will also conduct feasibility studies and testing on new and modified designs, and direct support personnel in the preparation of detailed design, design testing and prototype fabrication.

The ideal candidate should exhibit the following behavioral traits:

• Communication skills (verbal and written).
• Teamwork and collaboration skills in a design team.
• Positively Influencing stakeholders.
• Proactive thinking.
• Self-driven.

You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, and/or internship experience. Qualifications listed as preferred or additional will be considered a plus factor for applicants.

Minimum Qualifications:

• Candidate must possess a Bachelor's or Master's degree in Mechanical or similar STEM field (documentation related to Bachelor's degree completion will be required). 
• 1+ years at the Master's level or 2+ years at the Bachelor's level of experience.
• Advanced English and Spanish skills.

Preferred Qualifications:

• Heat transfer fundamentals.
• Thermal simulation software (such as Flotherm or Icepak).
• Hands-on experience of thermal testing.
• MATLAB, Labview and statistical methodologies.
• Experience in feedback control of dynamic systems.
• Experience with fundamental electrical engineering principles.