As a Thermal Platform Application Engineer intern, you will be working with experienced Intel engineers on exploring the opportunities to further optimize thermal/mechanical solutions for next generations server platforms, and/or pathfinding new methodologies to address the thermal challenges for future data centric systems and usages. You'll also have opportunities to participate and support ecosystem enablement events and activities.

Qualifications

• Major in Mechanical Engineering or related field.

• Familiar with Thermal/Mechanical simulation/computing analysis and related development tools such as Pro-E, ABAQUS, Flotherm, IcePak, 6-Sigma, etc.

• Good programming skills in CC and python and familiar with software development process and development tools like git is a plus.

Inside this Business Group

The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world's most critical computing platforms which fuel Intel's most important business and solve the world's most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.