Responsibility:
Lead thermal design development for various electronic products, server/storage product thermal design experience is preferred
Provide high quality thermal solution/response to support RFQs
Design robust thermal solutions to meet product specifications, and cooperate with Software team to implement fan speed control strategy.
Conduct thermal simulation analysis from Board to system level to verify thermal feasibility/risk.
Document thermal test plan and perform thermal, air flow/impedance, acoustic measurements.
Interface with a multi-disciplinary group to define system requirements, and design products. Experience in working in medium sized multidisciplinary development teams.
Interface with heat sink and air mover vendors to keep up to manage cost, quality and functionality.
Work with function team to identify route cause of system failure
Keep tracking on leading-edge cooling technology
Requirement:
Candidates should have 6+ years’ experience in thermal design/simulation/test validation for electronic product, Storage/server/switch product experience is preferred
BS or above in Thermodynamic relevant Engineering
Strong user of Flotherm as CFD analysis tool. Transient analysis experience is a plus
Expertise in various heat sinks, heat pipe, Vapor chamber design/selection, liquid cooling or other advanced cooling technology is a plus
Expertise and experience in various fan speed control methodology and over temperature protection mechanism
Familiar with thermal measurement technology and test tools such as temperature data logger, IR camera, wind tunnel, air speed meter etc.
Knowledge about Mechanical design tool such as Pro/E considered as a plus
Knowledge of server/storage/switch system architecture is a plus
Familiar with industry standard including SBB, NEBS, GR-63, ASHRAE TC9.9,etc
职能类别: 电子技术研发工程师 技术研发经理/主管
关键字: thermal design
联系方式
上班地址:东莞松山湖科技产业园区北部工业园
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