Are you eager to guide Intel product designs through key step of mechanical reliability and thermal integrity when make best use of advanced technologies? Then you are a good candidate for this position in a simulation engineering team being part of an organization, whose international experts enable the ecosystem of semiconductor technologies to many Intel products. You will be responsible for topics like:

• Assessing mechanical reliability and manufacturability of advanced package technologies using mechanical and thermo-mechanical FEA and CAD methods, e.g., predicting warpage, bump stress, solder joint reliability.

• Analyze, develop, and specify package related thermal and mechanical design rules applying the same methods.

• Collaborate and interact with product architects and designers to realize their requirements concerning tools relevant for this in design flow as well as employed methods.

• Technology and EDA/MDA tool suppliers to realize advance methods, e.g. machine learning.

• Assessing design and hardware limitations of products related to thermal properties of packaged chips in typical product applications and help to develop appropriate product and platform characterization and verification methods.

• Developing simulation and modeling methods for product concept phase thermal analysis of packaged chips and perform parametric studies.

• Developing utility programs for interfacing and processing of input and output data of the applied software tool.

You will become part of a company which continues to change the world through its brilliant people. To reward the amazing contributions of our people we offer a market competitive compensation & benefits package including plenty of family and flexible work benefits (i.e. the opportunity for part time home office work), programs that focus on your health and wellbeing, many development opportunities and enough time to relax, re-charge and retreat.

 

We believe in flexible working models (i.g. hybrid). Intel is an equal opportunity employer.

Qualifications

You should possess a Master or Diploma degree in Physics, Mechanical or Electrical Engineering or Physics. A minimum of 3 years' experience in simulation or design automation of development in semiconductor industry or an equivalent Ph.D. program and/or equivalent training are required. By this you have acquired profound experience in

• numerical simulation of thermal and thermo-mechanical effects in single and multi-chip packages, on printed-circuit boards and in reference systems

• some of the following software tools and related flows: ANSYS Mechanical and IcePAK, Synopsys 3DIC, Cadence Celsius or Mentor Graphics FloTHERM, Simulia Abaqus

• chip interconnect and package manufacturing with emphasize on advanced 2.x to 3D as well as state-of-the-art flip-chip package technologies

• UNIX / Linux and typical scripting languages especially Python

Very helpful

• Additionally helpful are experiences in machine learning, especially its application to the responsibilities of the job.

• We also expect experience as a technical team member in international development projects, with proven problem solving and strong communication skills.

• English: fluent, German: favorable.

Inside this Business Group

In the Design Engineering Group (DEG), we take pride in developing the best-in-class SOCs, Cores, and IPs that power Intel’s products. From development, to integration, validation, and manufacturing readiness, our mission is to deliver leadership products through the pursuit of Moore’s Law and groundbreaking innovations.  DEG is Intel’s engineering group, supplying silicon to business units as well as other engineering teams.  As a critical provider of all Intel products, DEG leadership has a responsibility to ensure the delivery of these products in a cost efficient and effective manner.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.