Our client is the world leading IC design house, founded in USA. The company has strong US company culture and dedicated in develop the employee's

職務說明

• Improve wire bond yield rate and defect issue solution.
• Wire bond solution on new/novel packages development
• Provide recipe for wire bond process.
• Using Au/Cu/pCC wires on different types of bond pad strcutures.
• Wire bonder tool setup

理想的應徵者

• 3 + years experiences in Wire Bond related process, either from OSAT or IC Design house.
• Familiar with KNS wire bonder (Maxum, Connx etc)
• Strong foundation in statistical process control, engineering change control and process release strategies
• Fluency in English for writing and communicating.

福利待遇

• Global exposure and with working environment
• Attractive salary package
• Self-development opportunity by training programs
• Employee Assistance Program(EAP) provided

", "jobLocation" : { "@type" : "Place", "address" : { "@type" : "PostalAddress", "addressLocality" : "台北", "addressRegion" : "台北", "addressCountry" : "TW" } } }