Key Responsibilities:

• Understand device physics and develop physical models including optical, electrical and thermal aspects in semiconductor lasers. 
• Design and develop next generation VCSELs and/or other semiconductor lasers, including device design and modeling, mask layout, wafer fab process flow design, packaging, etc. 
• Improve current generation of 3D sensing VCSELs to achieve higher performances in terms of power conversion efficiency, pixel resolution, temperature stability, beam quality, divergence angle, modulation speed, and reliability, etc. 
• Design and develop 3D sensing transmitter module optics and high-speed laser diode drivers. 
• Data analysis to build correlation between performance and designs. 
• Work closely with epitaxial engineer, fab integration engineer, product engineer, packaging/testing, and foundry for new product development. 

Qualifications/Requirements:

• Deep understanding in device physics, strong analytical skills. 
• Strong capability in optoelectronic device design and modeling. 
• Hands-on experience in semiconductor laser design, wafer processing, reliability and failure analysis. Hands-on design experience in VCSEL and DFB lasers is a plus. 
• Understanding and experience in beam shaping optics is a plus. 
• Verbal and written communication skills in both English and Mandarin. Experience in Layout software, Matlab or other device simulation software is a plus. 
• Self-motivated, resourceful, trustworthy, and team player. 
• Dr. Degree in EE, optics, or physics. Fresh graduates are encouraged to apply.