• Technical supplier management for Wafer Level Package Technologies.
• Responsible to achieve and maintain yield and quality targets. Local support for New Product Introduction, ramp-up and High Volume Manufacturing, "firefighting" in case of issues.
• Key contributor to solve technical issues and drive task forces.

Qualifications

• A degree in Engineering Science, Chemical Engineering or Physics from University / University of applied sciences
• Work experience of at least 3 years and profound knowledge in Wafer Level Package Technologies (WLPT)
• Experience in project management to develop WLPT technologies / products
• Experience in cooperation with suppliers of semiconductor assembly services

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth