Wire Bond Process Engineer
Texas InstrumentsTaibeiUpdate time: August 26,2019
Job Description
About TI
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!
About the job
Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.
The responsibilities of the Wire Bond Process Engineer in this role include:
- developing wire bond solution on new/novel packages, qualification of new wires types/diameters
- new silicon nodes using Au/Cu/PCC wires on various type of bond pad structures
- with hands-on wire bond experience on wire bonder device setup and conversion
- wire bond recipe generation
- wire bonder error trouble shooting
- wire bond MTBA/PPH improvement
- supporting new products or cost saving initiatives
- 3 years above relevant experience
- Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
- Strong foundation in statistical process control, engineering change control and process release strategies
- Hands-on experience on KNS bonders (Maxum, ConnX, or higher model of bonders) will be added advantage
- Demonstrated strong analytical and problem solving skills
- Strong verbal and written communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Demonstrated ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for results
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Minimum requirements:
Preferred qualifications:
To be considered for this position, please apply.
Primary Location TW-TW-New Taipei City
Work Locations New Taipei City > Taiwan, Chung-Ho City-Hsin Nan 142, Sec. 1, Hsin Nan Road Chung Ho District New Taipei City 235
Job Manufacturing
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Regular
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Job Posting Jun 24, 2019, 4:10:54 AM
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