Company Description

eSilicon serves the $10B+ ASIC design and manufacturing markets for system OEMs and fabless semiconductor companies. Our customers have used our products and services to create semiconductor devices for a wide range of end markets. eSilicon offers design and manufacturing services, along with a rich portfolio of customizable memory IP, that makes us an ideal partner for creating semiconductor-based solutions no matter what the end market, no matter what the process node and no matter how fast the expected volume ramp.eSilicon services include ASIC design and the coordination of the global, outsourced manufacturing supply chain that implements those custom integrated circuits. We deliver the manufactured custom ICs in volume to our customers at a pre-negotiated price. We also develop memory IP and I/O products, both off the shelf and custom.

Field Applications Engineering

Job description

As Field Applications Engineer you will be responsible for representing the technical capabilities of our IPs and ASIC backend design/solutions. You will be working with the fastest and most challenging interfaces for networking and AI applications at system level, built using the most advanced CMOS processes available.

You will use your technical expertise to support the eSilcon Sales Team and the end customers in China. You will work directly with the eSilicon IP team, ASIC team and GMO team to support pre-sales engagements and post-sales system bring-up.

Support customers for the IP evaluation and usage within ASICs;

• Conduct customer presentations on features, capaibilities, and architecture of the IP

• Provide lab demonstrations of IP performance

• Work with customer, at their site, to demonstrate our IP in their systems

• Create design collateral such as application notes

Support customers for ASIC application in the modules/boards/systems;

• RTL integration for networking application/protocol

• High speed interface(high speed Serdes, DDR and HBM) integration and analysis, including signal integrity analysis

• Third-party IP selection and integration

• IP test considerations such as high speed loop back tests

• Chip bring-up support in NPI phase

Profile and qualifications include

The requirements listed below are representative of the knowledge, skill, and/or ability required.

This job is suitable for candidates with 8+ years level of experience in the field.

This job position is best suited for you if you have/are:

• Bachelors/Masters Degree in Electrical/Communications Engineering or equivalent.

• Very good communication skills, strong leadership and good attitude in organizing work and tasks.

• Ability to forecast required effort and resources to meet timelines.

• Background in chip design or IP application. High speed interface experience in the field is very much appreciated.

• Direct testing experience on key analog/digital blocks and key functions/parameters.

• Good knowledge of the SerDes architecture and common PAM2/PAM4 standards.

• Good understanding of Power and Signal Integrity requirements.

• Knowledge/experience of high frequency PCB design and simulation.

• Experience using tools for automatic testing (i.e. LabVIEW), scripting languages: Python, C, C++ and MATLAB.

• Must be willing and able to travel world wide

• Must be eligible to work in country of hire without restrictions