1. New technology Yield fast improvement: Co-work with RD/Fab Integration on solving the yield related problems by process optimization. 2. New product ramp up: Product T/P characterization and failure analysis 3. Be an interface between customer and Fab to improve product yield/quality and ensure the product success 4. Advanced technology development. 5. Location: Hsinchu/Taichung/Tainan Qualifications 1. Bachelor or above in EE or Physics related 2. Experience of Product engineering, Integrati...

1. SoC/ASIC & package architecture design for high performance computing with High bandwidth Memory (Server, Networking, AI, AR…etc) applications. 2. Execute SI/PI/RF/EMI validation for the system requirements on eye diagram, jitter, latency, IR drop, cross-talk, and SSN specs from chip to PCB. 3. Develop system integration design and requirement based on SiP, PoP, PiP, Chip stacking, and other 3DIC technologies. 4. Working with marketing/technology team on technology competitive analysis an...