Intel China Dalian Technology Development (DTD) Center is hiring

We are looking for engineers at all levels to be part of Intel's fast-growing Non-Volatile Memory Solutions Group (NSG) business unit. 

Intel China Dalian Technology Development Center
It is Intel’s first silicon process research and development organization outside of the U.S. Because of Intel’s strategic investment in the memory business, we are ramping up the DTD organization. It leads the industry with cutting-edge innovation, focusing on developing next-generation Non-Volatile Memory technologies. Joining this organization will mean the chance to define the future of memory that powers the smart and connected world, and the opportunity impact Intel’s key markets—IoT, data center, and CPU. 

Position 1- Intel Technology Development Process Engineer

This job requisition is looking for multiple candidates for the Process Engineer position, reporting to TD Module Engineering Managers.  Successful candidates will be responsible for activities covering process, equipment, materials, and operations in their respective areas of expertise, such as CVD, PVD, CMP, Diffusion, Implant, Metro, Lithography, Wet Etch, and Dry Etch.

Examples of scope of work include silicon process improvement, product enhancement, equipment capability evaluation and expansion, and wafer cost reduction.  

Candidates must have a demonstrated track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization.

Responsibilities include: 
•    Perform feasibility study and provide module level process solutions to meet desired device specification and process improvement requirements; 
•    Lead new process experimentation, implementation and high volume manufacturing readiness in the area of expertise; 
•    Define, select, and qualify the equipment platforms to meet quality and output needs of new processes for high volume manufacturing ramp.

Position 2- Intel Technology Development Yield and Integration Engineer

This job requisition is looking for multiple candidates for the positions of Yield Engineer, FA Engineer, Defect Reduction Engineer, Integration Engineer, Device Engineer, Quality and Reliability Engineer, and Test Engineer, reporting to TD Integration Manager or Device Engineering Managers. 

Examples of scope of work include silicon process improvement and product enhancement, device capability evaluation and expansion, and wafer cost reduction.  

Candidates must have a demonstrated track record of excellence in creative problem solving, device or test capability enabling, or manufacturing process optimization in a relevant engineering organization.

Responsibilities include: 
•    Perform feasibility study and provide integrated process solutions to meet desired device specification and process improvement requirements; 
•    Lead new device experimentation, implementation and high volume manufacturing readiness in the area of expertise; 
•    Define, explore, and qualify new integrated process solutions to meet quality and output needs of new processes for high volume manufacturing ramp.
 

Qualifications

Qualifications
•    Recent completion, or upcoming completion in 2019, of a PhD in science or engineering;  
•    Direct experience in semiconductor research or fabrication environment is highly desired; 
•    Technical leadership and a track record of creative problem solving and out-of-the-box thinking;
•    Strong expertise in process characterization, qualification, and troubleshooting is required. 

Preferred qualifications 
•    Motivated self-starter, with strong ability to work independently and in a team environment; 
•    Strong verbal and written communication skills in English;
•    Ability to think and operate independently, while simultaneously focusing on many diverse priorities;
•    Flexibility and maturity in facing uncertainties and changing priorities or responsibilities;
•    Commitment to aggressive goals with a can-do spirit;
•    Strong sense of urgency and acting with velocity;
•    The ability to work across different cultures, with an attitude of respect an inclusiveness
•    Agility in learning, improving, and innovating. 

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.