Failure Analysis Engineer
Intel CorporationDalianUpdate time: March 13,2020
Job Description
Job Description

Responsible for identifying and researching component failures to improve product yield, quality and/or reliability. Evaluates the electrical and mechanical characteristics of integrated circuits, components, subcomponents, and systems to determine the root cause of failure. Analyzes failure reports and recommends corrective action to prevent reoccurrence of problems. Uses all standard electronic test equipment (digital/analog) such as Logic analyzer, ICE, ITPO oscilloscope and test systems to do board failure analysis and debug. May support new product transfer and startup and the automation and improvement of the failure analysis process. Strives to proliferate shared learning across sites. Maintain necessary records and reports. Performs other related duties as required or as directed.


Qualifications

You should possess a Bachelor or a Master of Science degree or a Ph.D. in Material Science, Chemistry, Chemical Engineering, Physics, Computer Science, Electrical Engineering or equivalent experience and/or degree and/or background. Additional qualifications include:
- Ability to demonstrate in-depth understanding of analytical equipment and semiconductor process flow operation
- Good team player and be able to establish collaborative relationships with internal customers
- Knowledge of basic statistics would be an added advantage
- Lab experience with Inductively Coupled Plasma Mass Spectrometry (ICPMS), Scanning Electron Microscopy (SEM), Focused Ion Beam (FIB), Secondary Ion Mass Spectrometry (SIMS), Transmission Electron Microscopy (TEM), Electrical Testing using Magnum tester and Fault Isolation using emission based techniques or similar would be an added advantage

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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