Job Description
Process Engineers develop and sustain such processes as diffusion, etching, plating, lithographic printing, thin film deposition in semiconductor fab manufacturing operations. Plans and implements capacity, and operational improvements to maximize output while improving the safety and quality of operations. As module owner, conducts tests and measurements of their operations to determine control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products. Establishes and submits processing requirements to be met in designing and acquiring processing equipment. Exercise independent judgement and discretion by making recommendations and adjusting tools and processes reactively when something has changed on the line or proactively in order to maximize output. Develops solutions to problems utilizing formal education and judgement.

Qualifications

About DMTM: Intel will produce its latest 3D NAND technology at our F68 site with initial production expected in the second half of 2016. Intel's manufacturing site in Dalian has achieved world class operations and expertise. F68 has been in operation since 2010, producing 65-nanometer products for Intel. The collaboration with the Dalian government has been and continues to be an excellent partnership. We have a long-term plan for this facility and may invest up to $5.5 billion over the coming years to transition this site to support leading-edge non-volatile memory production. This new business investment will make Intel Dalian Intel's first global integrated circuits manufacturing center for leading-edge 300mm non-volatile memory products and is a natural evolution to Intel's Dalian site. Litho process engineer is responsible for transferring new product to production Fabs and directing the sustaining/improvement efforts for yield and equipment performance.