Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

The candidate will be responsible for:

• Influencing the architecture/design, materials selection and structural integrity of high performance IC packages and other associated components and collaterals under manufacturing, test and usage conditions.
• Focus on linear and non-linear response analysis and testing of microelectronic packages, devices and enabling components.

The candidate will be expected to identify, assess and/or develop key analytical techniques. As part of the job function, candidate will also be expected to interact with other engineers to define and execute validation experiments as part of technology and process development.

Qualifications

You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Requirements:

- Possess a PhD degree in Mechanical Engineering, Applied Mechanics or related disciplines.

- The candidate must have 1+ years of working or educational experience in one of the following:

• Solid Mechanics.
• Static and dynamic analyses.
• Metals and polymeric material behavior and failure mechanisms.
• Linear and non-linear finite element methods.
• Knowledge of commercial finite element and computational software.

Preferred:

6+ months of knowledge or experience in:

• Integrated Circuit (IC).
• Packaging and Printed Circuit Board (PCB) technologies.
• Mechanical Design and Experimental methods.

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.