Packaging Research and Development Engineering Graduate Intern
Intel CorporationHillsboroUpdate time: January 25
Job Description

Graduate Internship position with Assembly and Test Technology Development (ATTD) Core Competency Laboratory at Intel, located in Hillsboro, Oregon to support the development of new packaging technologies and assembly processes.

Responsibilities include, but are not limited to:

  • Qualifying, trouble shooting, and using metrologies to characterize materials, components, and assembly processes.
  • Designing and integrating new custom, first-of-kind tools for mechanical and material characterization. Developing methodologies for the same.
  • Preparing test material, formulating sound experiments or test strategies, executing experiments, reducing data, and drawing conclusions.
  • Utilizing sound technical judgment and research resources to overcome technical challenges.
  • Managing work priorities and engaging with stakeholders to ensure timely completion of deliverables.
  • Documenting procedures, processes, and work results.
  • Observing and promoting safety, EHS, and ISO compliance.


The successful candidate will demonstrate the following characteristics:

  • Foundation in technical principles and practices of empirical science.
  • Quickly learn use of new tools and to understand technical principles and limitations of metrologies.
  • Self-motivation and pro-activeness to overcome challenges.
  • Intellectual curiosity, creativeness to develop new solutions, and willingness to try new approaches.
  • Self-accountability to apply necessary technical rigor to own work.
  • Diligence in documenting work and results.

This is an internship and compensation will be given accordingly based on candidate education level and internship duration.


Qualifications

This position is not eligible for Intel immigration sponsorship.

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.


Minimum Qualifications

  • Enrolled and pursuing a master's degree or PhD degree with 6+ months of experience in Materials Science/Engineering or Mechanical Engineering or related field.
  • 3.00+ GPA

6+ months experience in one or more of the following:

  • Mechanical or material testing instruments (MTS or Instron or equivalent)/fixture development.


Preferred Qualifications

6+ months experience in one or more of the following:

  • Non-contact surface topography and material deformation characterization techniques such as, but not limited to, moir, interferometry, digital image correlation, or other quantitative optical metrologies.
  • Abaqus finite element modeling.
  • Solidworks
  • Statistical concepts of empirical science and experiment design
  • Matlab or LabView programming.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.


Intel Corporation will require all new U.S. employees to be fully-vaccinated for Covid-19 as a condition of hire unless they have an approved accommodation in place under applicable law. Newly-hired employees will be required to provide proof of vaccination prior to their start date.



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USInternJR0194329HillsboroTechnology and Manufacturing

Get email alerts for the latest"Packaging Research and Development Engineering Graduate Intern jobs in Hillsboro"