• Maintain WDC's substrate design roadmap and substrate fabrication rules.
• Work closely with substrate suppliers to develop new substrate technologies or advanced design rules to meet product roadmap requirements.
• Handle and integrate all development activities related to substrates in the packaging process.
• Assist a DFM(design for manufacturability) process closely with Substrate layout designers to reduce the substrate design risk.
• Analyze the technical gap between the substrate suppliers and WDC substrate designs, drive and follow up with the substrate suppliers for improvement.
• Perform cost/performance trade-off analysis on various substrate design rules to realize the principle of low-cost design.
• Integrate substrate suppliers and packaging teams to solve substrate-related issues in the product development stage.

• Master degree or above in Material, Chemistry or engineering related.
• More than 3 years of packaging process experience or substrate manufacturing experience.
• Skills in SEM, FIB, TMA, DMA are preferred.
• Skills in DOE design, statistical analysis tools, AutoCAD are preferred.
• Good communication skill and office software skills.
• Good teamwork and quick learning.

All your information will be kept confidential according to EEO guidelines.