TD Mod & Integr Yield Eng
Intel CorporationDalianUpdate time: January 8,2020
Job Description
Job Description

As a Sr. Dry Etch Engineer, you will design and optimize plasma etch processes for leading-edge 3D NAND Flash products. You will take ideas from conception through process development then implementation in our production facilities. Your primary areas of responsibility include plasma dry etch process characterization, optimization, design, troubleshooting, process transfer and fundamental research. Sr. Dry Etch Engineer interact with groups such as process integration, electrical failure analysis, yield enhancement, manufacturing, and equipment vendors to ensure robust etch processes that meet the precise physical and electrical requirements. This position will utilize an aptitude for a research and development (R&D) environment. This position may often require weekend support to R&D Pilot Line Fab in case of manufacturing line excursions/downs and monitoring program critical lot through various modules as is deemed necessary.

Your responsibilities will include, but are not limited to:
� R&D Pilot Line Fab
o Updating the Fab engineers on customer issues and technology needs.
o Supporting root cause defect and unique fail mode analysis.
� Process Integration
o Delivering advanced technology to meet future product nodes.
o Developing recipes to meet structural & electrical requirements.
o Managing wafers though Dry Etch levels in support of special requirements.
� Other Process Areas
o Working in cross-functional teams to jointly develop CMOS structures.
o Supporting cross-functional failure analysis and yield improvement.
� Dry Etch peers
o Maintaining or developing expertise in multiple process, hardware, or technology areas.
o Serving as a resource for peers in recipe & process development.


Qualifications

� Knowledge or experience of plasma sources used in plasma etching.
� Knowledge or experience of dry etch processes and plasma processing equipment.
� Knowledge or experience of process control, analysis skills, statistics for engineering, and Statistical Process Control (SPC).
� Knowledge or experience of solid-state device physics.
� Knowledge or experience of semiconductor processes and metrology equipment used in the semiconductor industry.
� Knowledge or experience in other semiconductor manufacturing areas like Photo lithography, CVD, Wet Etch etc.
Must be willing to work evenings and weekends, if necessary.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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