TD Module Engineer
Intel CorporationDalianUpdate time: November 8,2019
Job Description
Job Description
TD Module engineer


Qualifications

Technical Qualifications
-- MS or PhD in a relevant science or engineering field from a prestigious school or research institute;
--Hands-on expertise and achievements in device design and simulation; product or material fabrication and characterization; instrument system setup and improvements;
--Excellent skills of problem solving with creativity and out-of-box thinking;
--Strong skills of data analysis, process characterization, qualification and troubleshooting;
--Semiconductor work experience is highly desired.

Other Qualifications
--Motivated self-starter, with strong ability to work independently as well as in a team environment;
--Strong verbal and written communication skills in English;
--Think and operate independently, while simultaneously focusing on many diverse priorities;
--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities;
--Commit to aggressive goals and win with a can-do attitude;
--Act with velocity and a strong sense of urgency;
--Respect cultural diversity and sensitivity;
--Agility in learning, improving, and innovating

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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