This is to seek an experienced candidate for Engineer of DTD Thin Films Deposition. In this role, the selected individual will be working process development and sync, hardware optimization in DTD CVD/PVD area, and report to the DTD Thin Films Engineering Manager. The job responsibilities include owning N+1, N+2 node deposition process and equipment development, co-owning the technology handover and synergy with HVM team, and collaborating with ATS counterparts for equipment and process enablement.

The candidate must have demonstrated a track record of excellence in systematic problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization.

Qualifications

Technical Qualifications:
--MS in a science or engineering field and minimum 5 years of experience in semiconductor R&D environment are required;
--Broad and deep knowledge of CVD or PVD equipment & processes is required;
--Hands-on experiences in technology development and technology transfer are highly desired;

Other Qualifications
--Motivated self-starter, with strong ability to work independently as well as in a team environment;
--Strong verbal and written communication skills in English.
--Think and operate independently, while simultaneously focusing on many diverse priorities.
--Commit to aggressive goals and win with a can-do attitude
--Act with velocity and a strong sense of urgency
--Be inclusive and respect cultural diversity
--Be eager in continuous learning, improving, and innovating
--Technical leadership is desired

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.