This position is Intel 3D NAND wafer level Test/Product Development Engineer for a high volume manufacturing fab located in Dalian, China. Qualified candidate is responsible for developing and maintaining wafer level functional test strategies and programs, developing innovative solutions for production test flows, interface hardware, and test equipment. Your responsibilities also include performing redundancy analysis schemes, optimizing device yields, and partnering with stakeholders to optimize and automate equipment and processes. As Test/Product Development Engineer, you'll initiate and lead cross-functional teams, develop and drive to meet project deadlines, and solve difficult technical problems with creative thinking.

Qualifications

-Minimum Qualifications: Bachelor/MS degree in Electronic Engineering or Computer Engineering.

- Advanced C/C++ programming and Linux skills.

- Proficiency in APG programming

- Fluent in both English and Mandarin.

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.