Sr. Camera EE
AmazonShenzhenUpdate time: July 15,2021
Job Description
Amazon Lab126 is an inventive research and development company that designs and engineers high-profile consumer electronics. Lab126 began in 2004 as a subsidiary of Amazon.com, Inc., originally creating the best-selling Kindle family of products. Since then, we have produced groundbreaking devices like Fire tablets, Fire TV, Amazon Echo,Blink and Ring devices. What will you help us create?
The Role:
As a key part of the camera team, you will be driving the electrical design of the camera module and the necessary supporting hardwares. You will be the owner of all aspects of EE hardware design, including circuit/board design and validation. You will work closely with an internal interdisciplinary team, and outside partners to drive key aspects of product definition, execution, and test. You must be responsive, flexible, and able to succeed within an open collaborative peer environment.
Develop core intellectual properties as well as defining EE imaging platform and roadmap.
Responsibilities:
The candidate will be responsible for the schematics and layout design of the camera module and supporting hardwares. The candidate will lead DFM processes with the contract manufactures and drive any technical related issues which includes Low and High Level Failure Analysis.
The candidate needs to be a strong and effective communicator and needs to be an independent and highly motivated individual with strong interpersonal skills
The Role:
As a key part of the camera team, you will be driving the electrical design of the camera module and the necessary supporting hardwares. You will be the owner of all aspects of EE hardware design, including circuit/board design and validation. You will work closely with an internal interdisciplinary team, and outside partners to drive key aspects of product definition, execution, and test. You must be responsive, flexible, and able to succeed within an open collaborative peer environment.
Develop core intellectual properties as well as defining EE imaging platform and roadmap.
Responsibilities:
The candidate will be responsible for the schematics and layout design of the camera module and supporting hardwares. The candidate will lead DFM processes with the contract manufactures and drive any technical related issues which includes Low and High Level Failure Analysis.
The candidate needs to be a strong and effective communicator and needs to be an independent and highly motivated individual with strong interpersonal skills
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