1. Be responsible for the assigned outsourced manufacturing supplier(s) to achieve required on time deliveries to satisfy Intel's business plans. Monitor and work with the supplier to ensure healthy wip flow and manufacturing progress in the shopfloor, to ensure Intel's required shipping plans are fulfilled on time. 2. Ensuring procurement orders are issued in compliance to policies and on time to assigned supplier(s). Drive activities at the suppliers to push for on time deliveries to s...

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The external Packaging and Assembly Engineering team (EPAE) will play a critical role in this strategy, leveraging external assembly technologies to deliver leadership products Seeking an assembly expert to strengthen the external assembly platform management team through deep underst...

Designs, develops, modifies and evaluates complex analog and mixed signal electronic parts, components or integrated circuitry for analog and mixed signal electronic equipment and other hardware systems. Determines creative design approaches and parameters. Analyzes equipment to establish operating data. Conducts experimental tests and evaluates results. Applies and uses independent evaluation to selects components and equipment based on analysis of specifications and reliability. Evaluates prac...

Description Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The external Packaging and Assembly Engineering team (EPAE) will play a critical role in this strategy, leveraging external assembly technologies to deliver leadership products Seeking a manager to lead the external New Product Introduction team through technical expertise...

About the Business Group: GEMS, Global External Manufacturing Sourcing, enables and supports all Intel external manufacturing requirements from technical, commercial and operations perspective Within GEMS, the External Manufacturing Sourcing Group (EMS) is responsible to manage the outsourcing of silicon foundry (wafer) and OSAT (assembly, test) business. This is an exciting opportunity to be part of the OSAT management leadership team, which collaborates with the Intel Business Units and the OS...

As a Yield Management Engineer, you will drive low yield analysis and yield improvement activities with both internal and external stakeholders. Your key responsibilities include: 1) Leading cross-functional teams across different regions to conduct yield gap analysis 2) Driving high volume products to meet yield and cost savings target 3) Leading cross-functional low yield problem-solving work groups 4) Tracking suppliers Defect Density Roadmap against actual Si performance Qualifications 1) Ca...

Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for early engagement with NPI development to ensure robust package quality, reliability and manufacturability. Flawless execution on product ramp and HVM sustaining activities including yield improvement, change control, excursion management and value engineering proje...

As a Yield Management Engineer, you will drive low yield analysis and yield improvement activities with both internal and external stakeholders. Your key responsibilities include: 1) Drive in-depth post-Si optimization in the post-TO to PRQ phase of a product with the primary goal to figure out solutions to improve PPA and beat yield targets. 2) Leading cross-functional low yield problem-solving work groups 3) Tracking suppliers Defect Density Roadmap against actual Si performance 4) Create, dev...

The candidate will join IOG (Intel Optane Group) Backend Manufacturing Engineering team for product development engineering and manufacturing support of IOG's high performance and revolutionary Optane Persistent Memory and Solid-State-Drive products, which will be in NPI (New Product Introduction) phase or in HVM (High Volume Manufacturing) phase at ODMs in Taiwan. The primary responsibility of this role is to identify and resolve module failures (especially Optane Media related failures) fr...

Senior Technologist of Packaging Technology and Engineering External Manufacturing Production (EMP) team is chartered with high volume manufacturing of Intel products with our 3rd party Foundry and OSAT suppliers. EMP seeks Senior Technologists for Packaging Technology and Engineering, but not limited to: Provide project management, package technology assessment and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units d...

External Manufacturing Production team (EMP) is a department within Global External Manufacturing and Sourcing (GEMS) chartered with enabling world class collaboration and execution with our 3rd party Foundry, Assembly and Test suppliers. EMP seeks a dynamic Business Operations manager/TA responsible for, but not limited to: Run weekly Operations review including Foundry, OSAT execution indicators Work with Leadership team to develop KPI/OKRs and manage execution Partner with Finance to manage t...

Foundry Technology Engineering (FTE) group under Global External Manufacturing and Sourcing (GEMS) is looking for a highly motivated and experienced individual to be part of an exciting engineering team dedicated to enabling and supporting Foundation IPs for Intel design projects (such as client, server, core, atom, graphics, mixed-signal IPs, testchips and other SoC projects) to be successful on external foundry process technologies. As a Senior Memory Design Engineer, you will collaborate and ...

1. Responsible for establishing consistent process across OSATs to ensure good test quality and results (e.g: supply, quality, yield, cycle time). 2. Establish BKM process for wafer sort and final test processes and OSATs proliferation. 3. Creates test hardware checkout criteria and maintenance requirements to OSATs. - Prober and handler recipe - Probecard, Loadboard IOQC criteria - Probecard overdrive, online clean, rebuild criteria and PM rule - Loadboard, Change-kit and socket PM rule - Pogo ...

1. Conduct external foundry technology evaluation, transistor device matching, and identify Si gaps (through yield data log analysis, understanding test algorithms and relevant circuits, and coordinating cross-functional matrix task force teams on reaching desired yield, product performance, and KPIs.) 2. Evaluate manufacturing window and process capability. 3. Work with Foundry to drive results by tracking actions, managing, resolving excursions, and identifying process improvement opportunitie...

1. Responsible for establishing consistent process across OSATs to ensure good test quality and results (e.g: supply, quality, yield, cycle time). 2. Establish BKM process for wafer sort and final test processes and OSATs proliferation. 3. Creates test hardware checkout criteria and maintenance requirements to OSATs.- Prober and handler recipe- Probecard, Loadboard IOQC criteria- Probecard overdrive, online clean, rebuild criteria and PM rule- Loadboard, Change-kit and socket PM rule- Pogo pin l...

Responsible for ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp. Make significant contributions to design, development and validation of testability circuits. Evaluation, development and debug of complex test methods. Develops and debugs complex software programs to convert design validation vectors and drive complex test equipment. Creates and tests validation and production test hardware solutions. Tests, valida...

1. Responsible for establishing consistent process across OSATs to ensure good test quality and results (e.g: supply, quality, yield, cycle time). 2. Establish BKM process for wafer sort and final test processes and OSATs proliferation. 3. Creates test hardware checkout criteria and maintenance requirements to OSATs. - Prober and handler recipe - Probecard, Loadboard IOQC criteria - Probecard overdrive, online clean, rebuild criteria and PM rule - Loadboard, Change-kit and socket PM rule - Pogo ...

The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a privately-held large company headquartered in San Jose, California with offices world-wide. Solidigm is a l...

Responsible for production support engineering with respect to testing methods, procedures, and problem device specification and yield problems minor redesign of devices and masks analysis of customer returns and optimizing device production relative to cost constraints. Assumes responsibility for device after transfer into high volume production and usually responsible for entire device manufacturing operations other than wafer fabrication. May assist customer in device usage problems or custom...

This job is to work with external silicon foundry suppliers and Intel various organizations to enable Intel outsourced products manufacturing to the most advanced process technologies. The responsibilities cover both new product introduction (NPI) engineering and risk production ramping including technical program management, fab process optimization, devices eTest analysis and optimization, and yield analysis and improvements. It is a job giving you opportunities to be involved in the semicondu...