Results 1 - 20 of 426
  • Intel Corporation Hsinchu

    Support IP layout porting efforts. Work with BU to implement IPs with foundry technologies. Work with BU and IP mask designers to complete IP layout design for test chip validation and product use. Support full chip DRC/LVS and TO gatekeeper Qualifications 7 years of experience with proven record of delivering high quality layout Expertise in Virtuoso EDA tools and familiarity with UNIX environment 5 years design experience in analog or stdcell layout design is a plus Collaboration and team lead...

  • Intel Corporation Hsinchu

    In this role, you will have the opportunity to work on leading edge and define future technology nodes. A typical project may combine more than one of the following (not limited to the ones listed below): - Device: Advanced device transport, quantum effects, stress effects, self-heating, defect-related phenomenon, electronic structure, novel device and memory operation, optoelectronics, mesh generation - Process: Modeling for implantation, diffusion, annealing, etch, deposition, epi growth, oxid...

  • Intel Corporation Hsinchu

    External Manufacturing Production (EMP) team is chartered with high volume manufacturing of Intel products with our 3rd party Foundry and OSAT suppliers. EMP seeks a dynamic Process Value Engineer for the following responsibilities, but not limited to: As Semiconductor process technology expert, work with foundry teams to identify, validate and roll-out robust process solutions/improvement actions for yield and PPAC improvement with external foundry partners. Participate in defining process chan...

  • Intel Corporation Hsinchu

    The Pathfinding Overall Integrator role within the Foundry Technology Engineering (FTE) of Global External Manufacturing and Sourcing (GEMS) is chartered to examine the interaction of process and design rule definition with overall process integration including implications to performance/power, area, cost, yield, manufacturability, and product ramp strategy. In this role, you will be working with world-leading technology and design experts on advanced technology pathfinding and definition. This...

  • Intel Corporation Hsinchu

    This job is to work with external silicon foundry suppliers and Intel various organizations to enable Intel outsourced products manufacturing to the most advanced process technologies. The responsibilities cover both new product introduction (NPI) engineering and risk production ramping including technical program management, design debugging, fab process window characterization and optimization, devices analysis and optimization, and yield analysis and improvements. It is a job giving you oppor...

  • Intel Corporation Hsinchu

    In this role, you will have the opportunity to work on leading edge and define future technology nodes. A typical project may combine more than one of the following (not limited to the ones listed below): * Device: Advanced device transport, quantum effects, stress effects, self-heating, defect-related phenomenon, electronic structure, novel device and memory operation, optoelectronics, mesh generation * Process: Modeling for implantation, diffusion, annealing, etch, deposition, epi growth, oxid...

  • Intel Corporation Hsinchu

    As an integral part of Intel's new IDM2.0 strategy, we are establishing Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to the CEO. IFS will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally. Intel Foundry Services will be differentiated from other Foundry offerings with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe - avail...

  • Solidigm Hsinchu

    Company Description Join a new multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Solidigm is headquartered in San Jose, California, with aspirations to conduct an IPO and become a publicly traded U.S. company under the CEO, Rob Crooke’s, vision. Solidigm combines elements of an established, successful Silicon Valley technology company with the spirit, agility, and entrepreneurial mindset of a s...

  • Intel Corporation Hsinchu

    Define/Support probe and contact technology for Wafer Sort and Final Test Responsible for the definition and mechanical design of Test Collaterals (e.g. SIU, TIU, Socket, CK) while ensuring they are designed for manufacturing Enable Wafer Sort, Final Test, System Level Test and Post-Test (scan/pack/label) capability setup for NPI projects at OSATs Provide technical support for mechanical related issues during High Volume Manufacturing Drive Probe, Contact and Post-Test cost saving projects Quali...

  • SIEMENS Hsinchu

    Siemens EDA seeks a highly motivated technologist with the capability and desire to make a significant contribution to the IC design and manufacturing industry. This latest addition to our world class team will support the 3DIC projects of Calibre Sahara and 3DStack product lines focusing on the area of thermal simulation and physical verification. This Advanced Product Engineer position plays an important role in the TSMC 3DIC project cooperation. This person will have the opportunity to work w...

  • Intel Corporation Hsinchu

    1. Covering wafer sort, Final Test and Burn-In at OSAT 2. Establish maverick lot on hold criteria with BU. 3. Assessing and disposing maverick lot when limits are triggered. 4. Drive maverick lot on hold improvement program 5. Drive excursion case or major quality/delivery issue 6. HVM test program and test hardware readiness checkout at OSAT 7. Drive sort/test operation stability at OSAT 8. Wafer/Final Test program coverage optimization 9. Contribute to Testability Requirements with the Design ...

  • Intel Corporation Hsinchu

    Responsible for driving continuous HVM quality performance of Foundry suppliers to meet Intel expectations through cultivating QOS+ quality culture and effective quality systems, tools and business processes implementation. In this role, you are required to work independently to conduct line audit, drive quality initiatives and systemic engineering solutions to ensure early detection and prevention of quality issues. You are also expected to manage quality excursions, perform technical Quality a...

  • Intel Corporation Hsinchu

    This External Foundry Quality and Reliability Engineer position covers QnR of foundry suppliers to ensure that Intel branded IC's manufactured externally meet Intel quality and reliability requirements. You will be working with partners and suppliers in multiple geos (Asia, Europe, and USA). This External Foundry Quality and Reliability position is part of the Global Supply Chain QnR/External Foundry OSAT QnR team which is accountable for QnR performance of all Intel ICs manufactured externa...

  • Intel Corporation Hsinchu

    THE ROLE: Test Value Engineering team is a Cost and Quality driven team responsible for supporting/driving global functional teams to improve test program stability in HVM, yield, and test time. From Early engagement in NPI to Ramp and HVM to achieve operation excellence. This Role is a technical individual contributor role on test program development and represents value engineering team on test excursions and issue escalations to the respective owner to identify resolution or containment actio...

  • SIEMENS Hsinchu

    The proFPGA Product Family fulfills highest requirements in the areas of FPGA-Boards and FPGA based Prototyping. Siemens EDA FPGA Prototyping Systems offer scalable high-performance Single and Multi-FPGA Solutions, which can be easily adapted and expanded by further proFPGA Modules with the latest FPGA generations and extensions cards equipped with interconnections, interfaces or memories. Services and Products for FPGA Prototyping: Single- und Multi- FPGA Prototyping Customized FPGA Boards Deve...

  • Intel Corporation Hsinchu

    External Manufacturing Production (EMP) team is chartered with high volume manufacturing of Intel products with our 3rd party Foundry and OSAT suppliers. EMP seeks a dynamic Assembly-Packaging Process Value Engineer for the following responsibilities, but not limited to: Provide project management, package development and sustaining support for IC or semiconductor assemblies, various other electronic components and/or completed units. As an Assembly/Packaging process expert, drive Assembly yield...

  • Intel Corporation Hsinchu

    External Manufacturing Production (EMP) team is chartered with high volume manufacturing of Intel products with our 3rd party Foundry and OSAT suppliers. EMP seeks a dynamic Process Value Engineer for the following responsibilities, but not limited to: Work with foundry teams to identify, validate and roll-out robust process solutions/improvement actions for yield and PPAC improvement with external foundry partners. Participate in defining process change validation plans with the foundry team. E...

  • Intel Corporation Hsinchu

    The Global Sourcing of Equipment and Material organization contracts and sources tens of billions of dollars on behalf of Intel Corporation. The scope of the organization covers a wide-range of goods and services from direct materials and equipment.The organization's key goals are: 1) ensuring uninterrupted supply to our customers, 2) delivering product and manufacturing affordability through the best total cost and 3) enabling products and the supply ecosystem to deliver non-linear value to...

  • Intel Corporation Hsinchu

    The External Manufacturing Supply Chain Engineer's focus is to establish and improve effective processes and systems of planning, sourcing, and procurement for the external supply chain and products. The supply chain engineer understands the business flows and dependencies of different processes such as in planning, sourcing, procurement, and delivery (SCOR model) for the organization. This role will work closely with the vertical and horizontal organizations to establish data systems and to...

  • Intel Corporation Hsinchu

    Define/Support probe and contact technology for Wafer Sort and Final Test Responsible for the definition of Test Collaterals (e.g. probe card, load board, socket, handler change kit) while ensuring they are designed for manufacturing Responsible for the mechanical design of the Socket and handler change kit Enable Wafer Sort, Final Test, System Level Test and Post-Test (scan/pack/label) capability setup for NPI projects at OSATs Provide technical support for mechanical related issues during High...

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