The Global Sourcing of Equipment and Material organization contracts and sources tens of billions of dollars on behalf of Intel Corporation. The scope of the organization covers a wide-range of goods and services from direct materials and equipment.The organization's key goals are: 1) ensuring uninterrupted supply to our customers, 2) delivering product and manufacturing affordability through the best total cost and 3) enabling products and the supply ecosystem to deliver non-linear value to...

The External Manufacturing Supply Chain Engineer's focus is to establish and improve effective processes and systems of planning, sourcing, and procurement for the external supply chain and products. The supply chain engineer understands the business flows and dependencies of different processes such as in planning, sourcing, procurement, and delivery (SCOR model) for the organization. This role will work closely with the vertical and horizontal organizations to establish data systems and to...

Define/Support probe and contact technology for Wafer Sort and Final Test Responsible for the definition of Test Collaterals (e.g. probe card, load board, socket, handler change kit) while ensuring they are designed for manufacturing Responsible for the mechanical design of the Socket and handler change kit Enable Wafer Sort, Final Test, System Level Test and Post-Test (scan/pack/label) capability setup for NPI projects at OSATs Provide technical support for mechanical related issues during High...

1. Responsible for establishing consistent process across OSATs to ensure good test quality and results. 2. Establish BKM process for wafer sort, final test and system level test processes and OSATs proliferation. 3. Creates test equipment checkout criteria and maintenance requirements to OSATs. 4. Responsible for prober and handler recipe management and optimization. 5. Responsible for prober, handler and final test & system level test change kits buyoff. 6. Creates OCAP handling procedure ...

1. Responsible for establishing consistent process across OSATs to ensure good test quality and results. 2. Establish BKM process for wafer sort, final test and system level test processes and OSATs proliferation. 3. Creates test equipment checkout criteria and maintenance requirements to OSATs. 4. Responsible for prober and handler recipe management and optimization. 5. Responsible for prober, handler and final test & system level test change kits buyoff. 6. Creates OCAP handling procedure ...

This position is associated with the sale of Intel's NAND memory and storagebusiness to SK hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.This is an exciting time to be at Intel - com...

THE ROLE: Test Value Engineering team is a Cost and Quality driven team responsible for supporting/driving global functional teams to improve test program stability in HVM, yield, and test time. From Early engagement in NPI to Ramp and HVM to achieve operation excellence. This Role is a technical individual contributor role on test program development and represents value engineering team on test excursions and issue escalations to the respective owner to identify resolution or containment actio...

1) Responsible for ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp for products manufactured at external foundries and Intel internal assembly and test facilities. 2) Make contributions to design, development and validation of testability circuits. 3) Evaluate and debug test methods to improve test stability and yield in manufacturing. 4) Analyzes and evaluates component specification versus performance to ensure ...

Microelectronic Packaging Engineers provide project management, package design/development and support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Understands overall package performance and specification and realizes technology certification through layout design and test vehicle design. Qualifications A degree in Electri...

Provides health services to employees or other persons on the company premises who become ill or suffer an accident. May work with Corporate Safety to recognize environmental factors and/or stresses in or from the workplace that my cause sickness, impaired health, or discomfort among the employees. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgement. This position will report to the Greater Asia Regional (GAR) Occu...

The global external Foundry Sourcing and Management (FSM) group manages the silicon outsourcing for Intel. Secure supply through a collaborative manufacturing network Under the guidance of the Supplier Account Manager, the Supply Line Manager coordinates cross-functional activities between Silicon Foundry supplier and relevant organizations of Intel, either within the supply chain organization or with involved business groups, to secure smooth operation and resolution of problems related to new ...

As an integral part of Intel's new IDM2.0 strategy, we are establishing Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to the CEO. IFS will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally. Intel Foundry Services will be differentiated from other Foundry offerings with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe - avail...

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research...

Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for early engagement with NPI development to ensure robust package quality/reliability and manufacturability. Flawless execution on product ramp and HVM sustaining activities including yield improvement, change control, excursion management and value engineering projec...

Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for early engagement with NPI development to ensure robust package quality, reliability and manufacturability. Flawless execution on product ramp and HVM sustaining activities including yield improvement, change control, excursion management and value engineering proje...

As an integral part of Intel's IDM 2.0 strategy, the Corporate Planning Group (CPG) is established matrix reporting to CEO, to drive world-class operational execution and superb centralized planning to address our customers' needs. CPG will accelerate the success of IDM 2.0 and enable business priorities across internal manufacturing, external manufacturing, and support all our customers for growth and success. CPG maximize impact with cross-BU, TD, and Manufacturing alignment, display i...

THE ROLE: Test Value Engineering team is a Cost and Quality driven team responsible for supporting/driving global functional teams to improve test program stability in HVM, yield, and test time. From Early engagement in NPI to Ramp and HVM to achieve operation excellence. This Role is a technical individual contributor role on test program development and represents value engineering team on test excursions and issue escalations to the respective owner to identify resolution or containment actio...

The Global Sourcing of Equipment and Material organization contracts and sources tens of billions of dollars on behalf of Intel Corporation. The scope of the organization covers a wide-range of goods and services from direct materials and equipment. The organization's key goals are: 1) ensuring uninterrupted supply to our customers, 2) delivering product and manufacturing affordability through the best total cost and 3) enabling products and the supply ecosystem to deliver non-linear value t...

Responsible for engineering support with respect to fault isolation capability enablement, failure analysis planning and product yield support. This position is to perform low yield analysis (LYA) of Intel outsourced products to external Si foundry advanced technologies and will be responsible for but not limited to: Enable Yield Explore (YE) scan and memory diagnostic capabilities for Intel new products to Foundry suppliers. Analyze scan and memory diagnostics data for low yield wafer commonali...

1. Responsible for ensuring the test stability and manufacturability of wafer sort and final test after production ramp. 2. Make significant contributions to wafer sort & final test yield improvement, site-to-site yield gap elimination and yield gap reduction. Evaluation, development and debug of complex test methods. 3. Works with internal cross-function teams, BUs and external manufacturing partners (OSATs) to ensure optimal match of test requirements with production equipment capability w...